Forensics

Semiconductor Wafer-Fabrication Equipment

Semiconductor Wafer-Fab Equipment/Repair Assessment :

Our professional staff has been involved with claims involving many types of equipment used in semiconductor wafer fabrication throughout world-class facilities in Singapore, Taiwan, China and South Korea. All of this equipment is state-of-the-art, highly sophisticated and very expensive.

  • Detailed examination & damage assessment
  • Local on-site repair is our first consideration
  • If repair is feasible, a cost estimate is prepared
  • When possible, we determine the cause and probable time/location of loss
  • Reports are prepared realizing that our findings may be presented in a court of law

Some of our work : The following photos represent several assignments carried out by FSG:

Clean-Room Air Particle Analyzer

Clean-Room Wafer Sorter

Shipping damage in transit to Chinese wafer-fab facility. Shipping damage in transit to Chinese wafer-fab facility.

Scanning Electron Microscope (SEM)

Nikon Stepper

Damage during production at Singapore wafer-fab facility. Shipping damage in transit to Singapore wafer-fab facility.

Steppers are considered to be amongst the most precise machines ever manufactured.

Clean Track ACT

Wafer Conveyor Transport

Damage during installation at Chinese wafer-fab facility. Damage during installation at Taiwan wafer-fab facility.

FSG indentifies start-up problems and recommends solution.

Nikon Stepper

Die Bonder Tool

Operational damage during production at Singapore facility. Shipping damage in transit to Chinese wafer-fab facility.

Surface Mount (SMT) Tool

Compressed Dry Air System

Shipping damage while in transit at Hong Kong warehouse. Damage during operation at a Singapore semiconductor facility.

Wafer Inspection Tool

Wafer Spin-Rinse Dryer

Shipping damage in transit to Korean wafer-fab facility. Shipping damage in transit to Chinese wafer-fab facility.

Broken/Shattered Silicon Wafers

Broken/Shattered Silicon Wafers

Shipping damage in transit to Taiwan wafer-fab facility.

FSG contributed to the re-design of future shipping containers.
Wafers (left) were first placed inside this special air-bag.

FSG discovered air-bag was over inflated & defeated the cushioning effect.

Please contact Forensic Services Group (Hong Kong) as your next technical consultant !